(A)Printing circuit board related raw materials
| Product Name | Product Use |
|---|---|
| Heat dissipate filler bronitride,Al2O3 for PCB material | heat dissipation board |
| Silica spherical powder for PCB material | boards |
| BMI(Bis-male-imide for resin additive) | resin additives |
| Liquid rubber for resin additive | resin additives |
| Epoxy resin | packaging material |
| Fluorine dispersant | fluorine filler dispersion |
(B)Multilayer Ceramic Capacitor (MLCC)
| Product Name |
|---|
| Terpineol and other terpene chemicals |
| Acrylic binder |
(C)Screen Printing Ink
| Product Use |
|---|
| ❶Solvent ink/UV ink |
| ❷Glass/Plastic panel printing ink |
| ❸Ink for in-mold decoration (IMD) |
(D)In-mold labling materials
| Product Name |
|---|
| Finishing agent |
| Enclosure decorations CPP film |
(E) Metal processing chemicals for silicon wafer, sapphire, crystal, SiC etc.
| Product Name |
|---|
| Slicing oil for silicon wafer |
| Diamond wire slicing coolant for silicon wafer、SiC |
| Lapping agents |
| Detergent |
| Rust preventive |
| Dispersant |
| Surface tension adjustment agents |
| Water-soluble cutting/grinding/cleaning/dispersing agent for optical lens, plate glass |
(F)Grind processing material for making copper foil
| Product Use |
|---|
| ❶PVA grindstones for wet grinding on surface of Ti-drum |
| ❷Non-woven flap wheel buff for wet grinding on surface of Ti-drum |
(G)PC resin for OPC drum
(H)Special water base polymer／monomer
| Product Use |
|---|
| ❶Thickening agent for paints |
| ❷Dispersant and stabilizer inorganic particles and pigments |
| ❸to provide affinity for water and alcohol |
| ❹Binder and binding agent |
| ❺Dissolution assistant for poorly water soluble substances |